Mission
Make integration happen and remove constraints from post-Moore infrastructure.
ABOUT / 04
THE FOUNDATIONFoundation
From a 500 m² laboratory to a 20,000 m² Suzhou production base, continuously building chip infrastructure for the post-Moore era.
Company
Suzhou Hanhua Semiconductor
Founded in 2017, Suzhou Hanhua Semiconductor is a global leader in heterogeneous 3D hybrid integration and operates China's only open 8-inch compound-semiconductor + IC hybrid-integration process platform.
We are a core heterogeneous-integration process manufacturer for the post-Moore era. We do not make end products; we provide foundational manufacturing infrastructure for heterogeneous chips.
Large-Format Compound Semiconductors × Wafer-Level 3D Heterogeneous Hybrid Integration.
Suzhou Base
Wafer-Level Heterogeneous Integration Manufacturing Base
China's first wafer-level compound-semiconductor + IC heterogeneous-integration production line supports the full journey from prototype and pilot runs to production introduction.
20000 m²Suzhou Manufacturing Base
9000 m²Cleanroom Area
8 InchCompound-Semiconductor + IC Hybrid-Integration Process Platform
Mission & Qualification
Mission & Qualifications
A long-term manufacturing platform supporting sustained innovation by design houses, system companies and research institutions.
Positioning
A core heterogeneous-integration process manufacturer and open manufacturing platform for the post-Moore era.
Qualifications
National High-Tech Enterprise and nationally recognized Specialized and Innovative Little Giant.
Vision
Serving global chip innovation with original process capabilities developed in China.
OUR MILESTONES
Milestones
Key steps in building Hanhua.
Company milestones are currently available in Chinese.
View Chinese milestones ↗Build the Next Generation of Semiconductor Infrastructure with Hanhua
sales@hanhuasemi.com · 0512-65922628 · Suzhou Industrial Park