Mission
Make integration happen and remove constraints from post-Moore infrastructure.
From a 500 m² laboratory to a 20,000 m² Suzhou production base, continuously building chip infrastructure for the post-Moore era.
Company
Founded in 2017, Suzhou Hanhua Semiconductor is a global leader in heterogeneous 3D hybrid integration and operates China's only open 8-inch compound-semiconductor + IC hybrid-integration process platform.
We are a core heterogeneous-integration process manufacturer for the post-Moore era. We do not make end products; we provide foundational manufacturing infrastructure for heterogeneous chips.
Large-Format Compound Semiconductors × Wafer-Level 3D Heterogeneous Hybrid Integration.
Suzhou Base
China's first wafer-level compound-semiconductor + IC heterogeneous-integration production line supports the full journey from prototype and pilot runs to production introduction.
Mission & Qualification
A long-term manufacturing platform supporting sustained innovation by design houses, system companies and research institutions.
Make integration happen and remove constraints from post-Moore infrastructure.
A core heterogeneous-integration process manufacturer and open manufacturing platform for the post-Moore era.
National High-Tech Enterprise and nationally recognized Specialized and Innovative Little Giant.
Serving global chip innovation with original process capabilities developed in China.
sales@hanhuasemi.com · 0512-65922628 · Suzhou Industrial Park