ECOSYSTEM / 03
OPEN ECOSYSTEM
Open Ecosystem
Openness is the defining principle of powerful infrastructure. Hanhua opens its PDK, complete foundry services and joint-development capabilities, turning heterogeneous integration into reusable, production-ready manufacturing infrastructure.
Infrastructure Law
The Infrastructure Law
History repeats itself: companies that define the next generation of technology infrastructure ultimately become leaders of their era.
Today, Hanhua is defining the integration paradigm of compound semiconductors × integrated circuits, reconnecting material systems, process languages and the wafer ecosystem.
Moving chips with different functions from package-level combinations to wafer-level integration.
Complete Foundry Flow
Complete Foundry Service from Incoming Epitaxy to Device Testing
Six stages can be used independently or combined into a complete service from prototype validation and pilot runs to volume production.
Incoming Wafer
Incoming Epitaxy & Process Assessment
Define process boundaries around materials, wafer size, device structure and integration goals to provide clear inputs for subsequent stages.
Silicon Removal
Wafer-Level Silicon Removal
Controlled wafer-level debonding enables intact large-area transfer for subsequent high-precision 3D integration.
3D Stacking
Multi-Material 3D Stacking
Supports 3D combinations of compound semiconductors, MEMS, lithium niobate and other heterogeneous materials with silicon ICs.
Hybrid Bonding
Wafer-Level Hybrid Bonding
Coordinates alignment, bonding and interconnects to integrate optoelectronic, power, sensing and logic functions at wafer level.
Packaging
Packaging & Process Integration
Connects downstream packaging to device structures and application requirements, creating repeatable process solutions.
Device Test
Device Testing & Production Introduction
Completes device testing, reliability evaluation and data feedback to support continuous iteration from prototype to production.
Open PDK
Open PDK Resources
Bring heterogeneous integration into familiar customer design and verification flows.
01
Design Rules
Provides DRC / LVS and related design-rule files.
02
Layouts & Models
Provides layout templates and simulation models.
03
Flow Integration
Integrates seamlessly with CMOS design flows.
Joint Development
Joint-Development Model
Our technical team joins at the device-definition stage to build an integration solution that is manufacturable, verifiable and scalable.
01
Collaborative Device-Structure Design
Jointly define structures around material, device and process boundaries.
02
Array & Circuit Co-Optimization
Optimize arrays, interconnects and circuits together around system goals.
03
Staged Collaboration
Progress continuously from prototype validation and pilot runs to volume production.
News & Milestones
News & Milestones
Tracking major technology breakthroughs, industry collaboration and policy support.
Production Line & Yield Progress
Updates on production-line commissioning, process maturity and yield breakthroughs.
Customers & Ecosystem Partners
Customer collaboration, ecosystem partnerships and joint-development outcomes.
Major Project Progress
Updates on national programs, major provincial industrialization projects and related development.
Start a Project
Contact
Tell us your device type, wafer status, integration goals or expected volume. Our technical team will arrange the next discussion.
Email
sales@hanhuasemi.com
Phone
0512-65922628