WAFER LEVEL / HETEROGENEOUS INTEGRATION / SUZHOU CN

Compound Semiconductors × Integrated Circuits

Heterogeneous 3D IntegrationA New Chip-Fusion Paradigm for the Post-Moore Era

Heterogeneous materials including compound semiconductors, MEMS and photonic chips are fused vertically with silicon ICs through atomic-scale processes, moving beyond the physical limits of Moore's Law.An original heterogeneous-integration process platform from China, built to support globally competitive AI infrastructure.

Explore the New Paradigm
Platform Capabilities / 01—03 Heterogeneous 3D Integration | Silicon Removal · Room-Temperature Bonding · TSV · 3D Stacking
Beyond Moore

Beyond Moore

Beyond Moore

Moore's Law is approaching its physical limits while demand for computing power continues to rise exponentially.

Beyond Moore: break material barriers through 3D heterogeneous integration, creating a new path for chip collaboration in the post-Moore era.

Hanhua is a core heterogeneous-integration process platform for the post-Moore era, focused on mixed-signal 3D integration for trillion-scale end markets. We provide chip-manufacturing infrastructure, not end products.

Hanhua: China's first open 8-inch full-stack process platform for compound-semiconductor + IC heterogeneous 3D integration

Core Moat

Core Technology

Core Technology Moat

Heterogeneous 3D integration is the core, supported by GaN epitaxy and an open manufacturing foundation spanning processes, PDKs and volume foundry services.

STACK 01

Heterogeneous 3D Integration · Full Stack

Wafer-level hybrid bonding closes the final gap in mixed-signal integration and defines a new semiconductor paradigm for the post-Moore era.

  • Non-destructive Silicon Removal
    Controlled 8-inch wafer-level debonding and intact large-area transfer with process yield above 95%.
  • 3D Stacking
    Room-temperature hybrid bonding with alignment precision below 200 nm, TSV compatibility and support for compound semiconductors, MEMS, lithium niobate and other heterogeneous materials.
  • Open PDK
    Provides DRC/LVS design rules, layout templates and simulation models aligned with CMOS design flows.
  • One-stop Foundry
    Epitaxial growth → front-end processing → hybrid bonding → non-destructive silicon removal → device testing, from prototypes and pilot runs to volume manufacturing, serving more than 90% of domestic design houses.

Full-stack heterogeneous 3D integration supports compound semiconductors, MEMS, lithium niobate and other materials, helping heterogeneous solutions reach volume production faster.

STACK 02

GaN Epitaxy · Supporting Capability

Optoelectronics / Power

GaN epitaxy process illustration
  • Optoelectronic Epitaxy
    Full-color silicon-based GaN Micro-LED supports AR/VR, digital headlights, optical interconnects and related applications.
  • Power Epitaxy
    High-efficiency energy conversion supports AI power, data-center PSUs, robotic drives and related applications.

High-quality epitaxial materials form a solid foundation for heterogeneous integration.

Enable All

Enable Everything

Enabling Every Industry

A deep-tech platform does not bet on one market; it becomes the common starting point for many. Hanhua provides foundational manufacturing processes and PDKs—not end products.

01

AI Infrastructure

Optical interconnects/CPO, AI power management, data-center PSUs and edge-computing nodes.

02

Embodied AI & Robotics

Humanoid robots, robotic joints, collaborative robots and service robots.

03

Spatial Computing & Interaction

AR/VR near-eye displays, digital headlights, holographic displays and spatial computing.

04

Communications & Infrastructure

5G-A/6G base stations, wireless-charging infrastructure and satellite communications/commercial aerospace.

05

Smart Mobility

Automotive HUDs, LiDAR, OBC/DCDC and smart-cockpit displays.

06

Industry & Energy

Industrial motor drives, photovoltaic inverters and industrial RF heating.

07

Medical & Healthcare

Medical endoscopy, biosensing and wearable health devices.

The value of infrastructure lies in the scale of the world it can support. Hanhua—semiconductor infrastructure.

The Law

Infrastructure Law

The Infrastructure Law

Every leap in infrastructure reshapes the industrial landscape. Today, Hanhua is defining a new integration paradigm for compound semiconductors and integrated circuits.

Those who define the infrastructure of the next era will stand at the forefront of innovation.

Open System

Open Ecosystem

Open Ecosystem

Openness is the defining principle of powerful infrastructure. Hanhua opens its PDKs, process modules and foundry services so design houses, system companies and research institutions can build heterogeneous chips on the platform.

01

PDK as a Service

Open DRC/LVS, layout templates, verification tools and simulation models.

02

Foundry as a Service

A complete production flow covering incoming epitaxy, silicon removal, bonding, packaging and testing.

03

Joint Development

Collaborative device-structure design, array/circuit co-optimization and staged engagement from prototype to production.

Foundation

The Foundation

Foundation

From a 500 m² laboratory to a 20,000 m² Suzhou production base, eight years focused on integration.

20000 m²Suzhou Manufacturing Base
9000 m²Cleanroom Area

China's first wafer-level compound-semiconductor + IC heterogeneous-integration production line. Mission: make integration happen and remove constraints from post-Moore infrastructure.

Suzhou heterogeneous integration production base Manufacturing base image / replaceable in admin

Build the Next Generation of Semiconductor Infrastructure

Open PDKs, process modules and foundry capabilities connect design with volume production.