A Distinctive Field
China's first and a globally leading open platform for heterogeneous 3D integration.
We are building chip infrastructure for the post-Moore era and welcome people who share that ambition.
Send Résumé →Why Hanhua
China's first and a globally leading open platform for heterogeneous 3D integration.
Core full-stack processes from material growth to wafer-level bonding.
A 9,000 m² cleanroom, China's first production line in this field and customer volume introduction.
Nationally recognized specialization, deep technical barriers and room for people to grow with the platform.
Our Culture
Respect technology, value innovation and use engineering thinking to solve world-class problems.
Flat management and deep cross-functional collaboration help ideas move quickly into practice.
Eight years focused on integration processes, building infrastructure rather than chasing trends.
Rewards & Benefits
Competitive compensation, annual bonuses and project incentives.
Equity incentive plans for key positions.
Statutory social insurance and housing fund, plus supplemental commercial insurance.
Paid annual leave, statutory holidays and flexible work arrangements.
Employee housing or housing allowance, meal allowance and transport subsidy.
Annual health checks, holiday benefits and team activities.
Technical training, industry-conference participation and internal advancement paths.
Open Positions
Current openings are updated by our HR team. Professionals in semiconductor materials, devices, processes, equipment and manufacturing are welcome to send a résumé.
Email subject: Name + Position
hr@hanhuasemi.com →